High speed method for plating palladium and palladium alloys
US9435046B2 · kind B2 · utility
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2Claims
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Key dates
| Filing date | Jun 22, 2013 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | Jun 27, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/56
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A high speed method of depositing palladium and palladium alloys is disclosed. The high speed method uses an aqueous, ammonia-based bath which has reduced free ammonia in the bath. The high speed method may be used to deposit palladium and palladium alloy coatings on various substrates such as electrical devices and jewelry.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.