Heat sink with an integrated vapor chamber
US9436235B2 · kind B2 · utility
22Cited by
5References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2013 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | Apr 26, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A cooling subsystem is provided for dissipating heat from processor. The cooling subsystem includes a heat sink comprising an upper portion having a plurality of fins formed therein and a base portion fixed to the upper portion to form a vapor chamber in an enclosed volume between the upper portion and the base portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.