RFID integrated circuits with large contact pads
US9436902B1 · kind B1 · utility
22Cited by
18References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 4, 2014 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | Sep 2, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/16225
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
An RFID IC assembly having a repassivation layer and a conductive redistribution layer may be assembled onto a tag substrate with an additional layer. The additional layer includes one or more etchants for creating an opening in a nonconductive barrier layer between the assembly and the substrate, and may also include an adhesive for attaching the assembly to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.