Semiconductor device connected by anisotropic conductive adhesive film
US9437346B2 · kind B2 · utility
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8Claims
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Key dates
| Filing date | Oct 9, 2013 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | Aug 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/07811
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device connected using an anisotropic conductive adhesive composition, the anisotropic conductive adhesive composition including a thermosetting polymerization initiator; and tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate, wherein the tetrahydrofurfuryl (meth)acrylate or furfuryl (meth)acrylate is present in the composition in an amount of 1 wt % to 25 wt %, based on the total weight of the composition in terms of solid content.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.