Semiconductor module
US9437518B2 · kind B2 · utility
3Cited by
11References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 2013 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | May 9, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/73253
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the operation of the semiconductor module, the connector can have a temperature lower than the devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.