LED module
US9437581B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 24, 2013 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | May 24, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/882
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.