Optoelectronic semiconductor component

US9437792B2 · kind B2 · utility

Assignee

• OSRAM GmbH · DE

Inventors

• Andreas Dobner · Wenzenbach, DE
• Joerg Sorg · Regensburg, DE
• Ralph Wirth · Lappersdorf, DE

Key dates

• Filing date: Aug 30, 2012
• Grant date: Sep 6, 2016
• Expiry date: Aug 30, 2032

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/3025
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

An optoelectronic semiconductor component includes: at least one optoelectronic semiconductor chip, a leadframe having one a plurality of leadframe parts, at least two electrical connection means via which the semiconductor chip is electrically contact-connected to the leadframe, and a potting body, which is fitted to the leadframe and mechanically supports the latter, wherein the one or at least one of the leadframe parts is provided with a reflective coating at a top side, the semiconductor chip is fitted on the reflective coating at the top side, the leadframe includes at least two contact locations, onto which the connection means are directly fitted, and the contact locations are formed from a material that is different from the reflective coating.