Package support, fabrication method and LED package

US9437793B2 · kind B2 · utility

Assignee

• Xiamen Sanan Optoelectronics Technology Co., Ltd. · CN

Inventors

• Jun-Peng Shi · Xiamen, CN
• Pei-Song Cai · Gongguan, TW
• Hao Huang · Xiamen, CN
• Xing Liang · Shanghai, CN
• Zhen-Duan Lin · Xiamen, CN
• Chih-Wei Chao · Baoshan, TW
• Chen-ke HSU · Xiamen, CN

Key dates

• Filing date: Jan 27, 2015
• Grant date: Sep 6, 2016
• Expiry date: Jan 27, 2035

Classification

• Technology area (CPC H): Electricity
• CPC primary: H01L2924/12041
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A package support including: metal frames connected together; one or more dielectric materials disposed in an inner gap of the metal frames; wherein: the package support has a frame region and a function region; wherein the function region has complete upper and lower surfaces configured to prevent leakage if at least one of the entire upper or lower surfaces is covered with an encapsulant material. A fabrication method allows for manufacturing the package support with a high cell density, relatively low price, high reflectivity, good heat dissipation, and high reliability. The LED package using the package support has a smaller size and improved dissipation properties.