Multi-layered thin film piezoelectric devices and methods of making the same
US9437802B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 21, 2013 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | Sep 22, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10N30/704
Abstract
Multi-layered thin film piezoelectric material stacks and devices incorporating such stacks. In embodiments, an intervening material layer is disposed between two successive piezoelectric material layers in at least a portion of the area of a substrate over which the multi-layered piezoelectric material stack is disposed. The intervening material may serve one or more function within the stack including, but not limited to, inducing an electric field across one or both of the successive piezoelectric material layers, inducing a discontinuity in the microstructure between the two successive piezoelectric materials, modulating a cumulative stress of the piezoelectric material stack, and serving as a basis for varying the strength of an electric field as a function of location over the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.