Method for manufacturing a circuit board with buried element having high density pin count and the circuit board structure
US9439292B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 6, 2015 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | May 8, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/166
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method for manufacturing a circuit board with a buried element having high density pin count, wherein a micro copper window formed in a first circuit by patterned dry film electroplating is easily controlled less than 50 μm so that the micro conduction holes formed after the laser drilling each has a diameter greatly shrunk less than 50 μm so as to highly increase density of the micro conduction holes, thereby facilitating in burial of the buried element with the high density pin count. Additionally, by disposing the micro conduction holes in the same elevation, optically aligning a fixing position for the buried element can be controlled precisely.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.