Housing for encasing an electronic device
US9439314B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 11, 2015 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | Nov 11, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F2200/1633
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An apparatus and system for housing a device include a housing that is configured such that a device may be fitted within the housing and thereby be protected, such as from shocks and/or liquid. The housing may include top and bottom members that may be removably coupled together so as to form the housing. Each top and bottom member optionally includes front and back surfaces surrounded by a perimeter. The perimeter may be defined by proximal and distal ends as well as opposing sides. The top and bottom members may include respective clasping mechanisms that extend along the perimeter of the top and bottom members. The clasping mechanisms are configured for coupling the top and bottom members with one another thereby sealing the housing, for instance, in a shock-proof and/or water tight seal.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.