Heat-dissipating EMI/RFI shield
US9439333B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 10, 2014 |
| Grant date | Sep 6, 2016 |
| Priority date | — |
| Expiry date | Jun 25, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat-dissipating EMI/RFI shield (100) has a shield base (110), a shield cap (130), and a heat sink (150). The shield base has at least one sidewall (112) which defines an open area (113). At least one mounting leg (114) extends from the sidewall and is affixed to a printed circuit board (200). The shield cap has a collar (136) which defines an opening in the shield cap. The shield cap is configured to be mated to the shield base. The heat sink has a boss (156) extending therefrom. The heat sink is configured to be mated to the shield cap. The boss is configured to protrude at least partially into the opening in the shield cap and to make thermal contact with a selected heat generating component (210) on the printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.