Thermally insulating low density structural wooden composite
US9440418B2 · kind B2 · utility
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19Claims
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Key dates
| Filing date | Aug 13, 2012 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Mar 5, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/268
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Wood-based composites, and methods for their manufacture, are provided. The composites include oriented wooden strands and cured bonding resin connecting adjacent strands. The composites are relatively low-density, having an average dry density of the wooden composites of about 15-28 pounds per cubic foot (pcf). The unique composition of the composites provide improved structural and insulating (thermal and acoustic) properties when compared to traditional engineered wood products (e.g., oriented strandboard).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.