Embossing apparatus
US9440453B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Feb 25, 2015 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Mar 16, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB41M3/16
- WIPO fieldTextile and paper machines
- WIPO sectorMechanical engineering
Abstract
An embossing apparatus comprises an embossing die comprising a printed relief pattern, and a resilient surface for pressing media against the embossing die to emboss features corresponding to the printed relief pattern on the media, in which the printed relief pattern comprises a number of layers of a deposited material, and in which a number of layers of the deposited material closest to the top of the printed relief pattern comprises a deposited material with a relatively lower coefficient of adhesion than layers of the deposited material disposed under the deposited material closest to the top of the printed relief pattern. A printed relief pattern for embossing media comprises a number of preliminary layers, the preliminary layers comprising a first material, and a number of terminal layers, the terminal layers comprising a second material, in which the second material has a lower adhesive coefficient than the first material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.