Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same
US9441086B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 13, 2013 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Dec 13, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09J2301/314
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable silicone composition containing a curable organosiloxane composition, silver, and at least one electrically conductive metal other than silver, the curable silicone composition being characterizable by a total silver concentration of from 50 to less than 60 weight percent and a thixotropic index that is adjustable from 3 to 10 measured according to TI Test Method while the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.001 Ohm-centimeter measured according to Volume Resistivity Test Method without increasing the total concentration of electrically conductive metal in the curable silicone composition to 72 weight percent or higher, the electrically conductive silicone adhesive, an electrical device comprising the electrically conductive silicone adhesive, and a method of manufacturing the electrical device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.