Silicon wafer processing solution and silicon wafer processing method
US9441179B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Oct 24, 2014 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Oct 24, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC10N2040/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A silicon-wafer processing fluid used for processing a silicon wafer contains a friction modifier containing a nitrogen-containing compound, pH of the nitrogen-containing compound being in a range from 2 to 8 when a mass ratio with water (i.e. nitrogen-containing compound/water) is 1/99. The nitrogen-containing compound is preferably a heterocyclic compound. The silicon-wafer processing fluid restrains an abrasion of abrasive grains rigidly attached to a wire and generation of hydrogen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.