Low temperature hermetic sealing via laser
US9441416B2 · kind B2 · utility
9Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 27, 2012 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Mar 22, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/1461
- WIPO fieldCivil engineering
- WIPO sectorOther fields
Abstract
A method and apparatus for low temperature laser sealing of bonded articles is disclosed. Hermetic sealing of glass substrates using low temperature sealing techniques that do not adversely affect bulk strength of glass substrates, the environment created between the substrates and/or any components housed within the sealed glass substrates is disclosed. Such low temperature sealing techniques include use of localized laser heating of sealing materials to form a hermetic seal between glass substrates that does not involve heating the entire article to be sealed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.