Lead-free high temperature/pressure piping components and methods of use
US9441765B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 16, 2015 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Nov 16, 2035 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12
- WIPO fieldMechanical elements
- WIPO sectorMechanical engineering
Abstract
A piping component for controlling the flow of fluids that includes a piping body having an inlet end and an outlet end, including methods of operating such components within a piping system. The piping body may be sized for fluids operating at temperatures from approximately 350° F. up to approximately 500° F., and up to approximately 650° F. In addition, the piping body is made from a silicon-copper alloy consisting essentially of less than 16% zinc, less than trace amounts of lead, less than trace amounts of bismuth, 2 to 6% silicon and a balance of copper (by weight). In certain aspects, less than 0.09% of lead and/or less than 0.09% bismuth are contained in the silicon-copper alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.