Thermally driven workload scheduling in a heterogeneous multi-processor system on a chip
US9442774B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 4, 2014 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Jul 9, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02D10/00
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Various embodiments of methods and systems for thermally aware scheduling of workloads in a portable computing device that contains a heterogeneous, multi-processor system on a chip (“SoC”) are disclosed. Because individual processing components in a heterogeneous, multi-processor SoC may exhibit different processing efficiencies at a given temperature, and because more than one of the processing components may be capable of processing a given block of code, thermally aware workload scheduling techniques that compare performance curves of the individual processing components at their measured operating temperatures can be leveraged to optimize quality of service (“QoS”) by allocating workloads in real time, or near real time, to the processing components best positioned to efficiently process the block of code.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.