Systems and methods for analyzing a bondline
US9443300B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 15, 2014 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Feb 7, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06T2207/30108
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for analyzing a bondline in a structure is provided. The method includes obtaining, from a first side of the structure, by at least one computing device, at least one first internal image of the structure that includes at least a first pattern associated with the bondline, wherein the structure is in a pre-loaded state and obtaining, from the first side of the structure, by the at least one computing device, at least one second internal image of the structure that includes at least the first pattern, wherein the structure is in a loaded state. Additionally, the method includes comparing, by the at least one computing device, the at least one first internal image with the at least one second internal image, and determining, by the at least one computing device, at least one stress and/or strain-related property of the bondline based on the comparison. The method additionally includes predicting an estimated life of the bondline, whereby the estimated life provides a valuable tool for optimization of maintenance effort and enabling cost-optimal maintenance decisions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.