Multilayer ceramic electronic component and method for manufacturing multilayer ceramic electronic component
US9443654B2 · kind B2 · utility
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14Claims
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Key dates
| Filing date | Dec 11, 2013 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | May 21, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G4/1227
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A multilayer ceramic electronic component achieves a high electrostatic capacitance and includes an Al inner electrode superior in smoothness and conductivity. The multilayer ceramic electronic component includes a multilayer body including a plurality of stacked ceramic layers and a plurality of inner electrodes arranged along certain interfaces between the ceramic layers and containing Al as a main component, and an outer electrode located on an outer surface of the multilayer body. A surface of the inner electrode is covered with a layer including a noble metal or Ti as a main component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.