Patent · US Active

Portable apparatus, IC packaging structure, IC packaging object, and IC packaging method thereof

US9443809B2 · kind B2 · utility

0Cited by
2References
14Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJun 5, 2015
Grant dateSep 13, 2016
Priority date—
Expiry dateJun 5, 2035

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01L2224/81193
  • WIPO fieldSemiconductors
  • WIPO sectorElectrical engineering

Abstract

A portable apparatus, an IC packaging structure, an IC packaging object, and an IC packaging method thereof are disclosed. The IC packaging structure includes an IC packaging object and a substrate. The packaging object includes a die and a metallurgy layer. The die has a contact portion, a saw reserved portion, and a seal ring. The seal ring is disposed between the contact portion and the saw reserved portion. The metallurgy layer is disposed on the contact portion. At least a part of the metallurgy layer overlaps the seal ring. The metallurgy layer includes a solderable layer coated by a solder paste. The substrate includes a solder pad. The solder pad is coupled to the solderable layer coated by the solder paste.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.