Printed circuits with embedded semiconductor dies
US9443830B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 9, 2015 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Jun 9, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electrical components such as semiconductor die may be mounted in semiconductor packages and embedded within printed circuits. A printed circuit may have a substrate with an opening and may have metal layers. During lamination operations, substrate material such as prepreg may flow and form embedding dielectric material that embeds the semiconductor die within the opening. Double-sided semiconductor dies may be formed by attaching multiple semiconductor dies together using a layer of material such as die attach film. The double-sided semiconductor dies may be embedded within a printed circuit and mounted in semiconductor packages. Wire bond wires may be used to couple one of the semiconductor dies in a double-sided semiconductor die to contacts on a substrate. Wire bond wires may also be used to couple a shield layer to the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.