Thin-layer encapsulation for an optoelectronic component, method for the production thereof, and optoelectronic component

US9444062B2 · kind B2 · utility

Assignee

• Osram OLED GMBH · DE

Inventors

• Dirk Becker · Bad Hersfeld, DE
• Thomas Dobbertin · Regensburg, DE
• Erwin Lang · Regensburg, DE
• Thilo Reusch · Donaustauf, DE

Key dates

• Filing date: Mar 22, 2010
• Grant date: Sep 13, 2016
• Expiry date: Mar 22, 2030

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y02P70/50

Abstract

A thin-layer encapsulation (1) for an optoelectronic component. The thin-layer encapsulation (1) comprises a sequence of layers (2) that comprises the following layers: a first ALD layer (3) deposited by means of atomic layer deposition, and a second ALD layer (4) deposited by means of atomic layer deposition. A method is disclosed for producing the thin-layer encapsulation and an optoelectronic component is disclosed having such a thin-layer encapsulation.