MEMS microphone module and manufacturing process thereof
US9445212B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 18, 2008 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Aug 4, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH04R19/016
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A micro-electro-mechanical system (MEMS) microphone module and a manufacturing process thereof are described. A thickness of a transparent temporary cover plate temporarily disposed in a conventional plastic package structure is adjusted. After a mold for a plastic protector is formed, an UV ray is utilized to irradiate the mold to reduce adherence on the temporary cover plate and a back surface of the MEMS acoustic wave sensing chip. Then, the temporary cover plate is removed, and the left space left is the main source for the back-volume of the MEMS microphone. Finally, a tag is covered on the plastic protector, so as to define the whole back-volume and form a closed back-volume. In the above-mentioned process, the size of the back-volume is the same as an area of the whole MEMS microphone chip. In addition, the back-volume can be defined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.