Capacitance touch panel module and fabrication method thereof
US9445495B2 · kind B2 · utility
0Cited by
2References
13Claims
0Family size
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Key dates
| Filing date | Dec 4, 2014 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Dec 4, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of fabricating a capacitance touch panel module includes forming a plurality of first conductive patterns on a substrate comprising a touching area and a peripheral area along a first orientation, a plurality of second conductive patterns along a second orientation, and a plurality of connecting portions in the touching area; forming a plurality of insulated protrusions, in which each insulated protrusion covering one connecting portion, and forming an insulated frame on the peripheral area; and forming a bridging member on each insulated protrusion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.