Etched multi-layer sheets
US9445517B2 · kind B2 · utility
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4References
8Claims
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Key dates
| Filing date | Mar 15, 2013 |
| Grant date | Sep 13, 2016 |
| Priority date | — |
| Expiry date | Mar 26, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method includes creating an opening in a first outer layer of a multilayer sheet of material, the sheet of material having three or more layers of material, including the first outer layer and a second outer layer. A selective etchant is introduced through the opening, where the etchant selectively etches an interior metal layer of the multilayer sheet of material compared with the first and second outer layers. The selective etchant is permitted to etch material of the interior metal layer under the first outer layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.