Ultrasonic probe and manufacturing method thereof
US9445782B2 · kind B2 · utility
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11Claims
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Key dates
| Filing date | Feb 20, 2013 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | May 6, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB06B1/06
- WIPO fieldMedical technology
- WIPO sectorInstruments
Abstract
The present application relates to an ultrasonic probe including a connector capable of applying an electrical signal to a piezoelectric material and disposed at the outside of a backing layer, and a method of manufacturing the same. The ultrasonic probe includes a piezoelectric material, a backing layer installed on the rear surface of the piezoelectric material, and a first connector installed on at least one side surface of the backing layer and electrically connected to the piezoelectric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.