Methods and apparatuses for cutting of thin film solar cells
US9446537B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 3, 2012 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Oct 8, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB30B11/227
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Methods and apparatuses for cutting thin film solar cells are provided. According to various implementations, the methods involve cutting a substrate having thin film solar cell materials deposited thereon by inducing a tear along the cutting line. Simultaneously with the tearing, the torn edges may be plastically deformed to produce a desired torn edge cross-sectional profile. Such a fracture may be induced by clamping regions of the substrate while simultaneously displacing the clamped regions relative to each other through the thickness of the substrate as the substrate is fed through the clamps providing the clamping. Apparatuses for cutting are also provided. According to various implementations, the apparatus may have cutter rollers and support rollers configured with an adjustable radial overlap.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.