Method for bonding plastics and method for releasing a bond in the plastic composite and a plastic composite
US9446574B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2013 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Jan 29, 2033 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1158
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
The invention relates to the field of chemistry and concerns a method suitable for example for use in the automotive industry or in aircraft construction. The object of the present invention is to provide a method by which a bonding of the regions of the plastics that are in direct contact is accomplished. The object is achieved by a method for bonding plastics in which materials which contain at least one electrically conductive material and only partially cover the plastics are applied to at least one of the plastics to be bonded, then the plastics are brought into contact with one another, at least in the region with the materials, and after that at least this region is exposed at least once to an alternating electromagnetic field.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.