Method for the fabrication of thin-film transistors together with other components on a substrate
US9446946B2 · kind B2 · utility
1Cited by
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11Claims
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Key dates
| Filing date | Sep 23, 2015 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Sep 23, 2035 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0742
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for the fabrication of thin-film transistors together with micromechanical components, other active electrical components or both on an amorphous or polycrystalline substrate includes disposing the thin-film transistors and the other components on different areas of the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.