Curable silicone compositions, electrically conductive silicone adhesives, methods of making and using same, and electrical devices containing same
US9447308B2 · kind B2 · utility
5Cited by
28References
11Claims
0Family size
Assignee
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Key dates
| Filing date | Mar 13, 2014 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Mar 13, 2034 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K2201/001
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A curable silicone composition comprising a curable organosiloxane composition, copper-silver (Cu—Ag) core-shell particles, and hydrocarbon vehicle; the curable silicone composition being characterizable by: a concentration of the Cu—Ag core-shell particles of from 70 to 89 weight percent and a total concentration of silver of from 7.0 to 14 weight percent, all based on weight of the curable silicone composition; wherein the composition remains curable to an electrically conductive silicone adhesive having a volume resistivity of less than 0.020 Ohm-centimeter measured according to Volume Resistivity Test Method.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.