Method of etching using inkjet printing
US9447504B1 · kind B1 · utility
1Cited by
0References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 28, 2015 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Sep 28, 2035 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D173/00
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A process of patterning a conductive film. The process comprises providing a substrate comprising a conductive film positioned on a surface of the substrate. A hydrophilic primer layer is coated on the conductive film. Droplets of etchant are ejected from an inkjet printer in an imagewise pattern onto the primer layer to pattern the conductive film. The primer layer is removed from the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.