Multi-point temperature sensing method for integrated circuit chip and system of the same
US9448122B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 4, 2013 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Jan 24, 2035 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/01
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A multi-point temperature sensing method for integrated circuit chips and a system of the same are revealed. The system includes at least one slave temperature sensor embedded at preset positions for measuring temperature of a block and a master temperature sensor embedded in an integrated circuit chip and electrically connected to each slave temperature sensor. Variations of the slave temperature sensor induced by variations of process, voltage and temperature are corrected by the master temperature sensor. Thus the area the temperature sensors required on the integrated circuit chip is dramatically reduced and the stability of the temperature control system is improved. The problem of conventional System-on-a-Chip that only a limited number of temperature sensors could be used due to the area they occupied can be solved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.