Conductive metal ink composition, and method for preparing a conductive pattern
US9449734B2 · kind B2 · utility
2Cited by
0References
10Claims
0Family size
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Key dates
| Filing date | Aug 26, 2011 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Jan 17, 2032 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0534
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
The present invention relates to a conductive metal ink composition, comprising: a first metal powder having conductivity; a non-aqueous solvent; an attachment improving agent; and a polymer coating property improving agent, and a method for forming a conductive pattern by using the conductive metal ink composition, and the conductive metal ink composition can be appropriately applied to a roll printing process and a conductive pattern exhibiting more improved conductivity and excellent attachment ability with respect to a board can be formed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.