Method of protecting a mounting tape during laser singulation of a wafer
US9449877B2 · kind B2 · utility
0Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 17, 2014 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Sep 17, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/03009
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method of singulating a semiconductor wafer with laser energy while the semiconductor wafer is supported on a mounting tape during singulation comprises the step of depositing a coating material onto a portion of the mounting tape adjacent to a perimeter of the semiconductor wafer to form a protective layer over the mounting tape. The semiconductor wafer is then cut with a laser beam such that the laser beam at least partially impinges upon the protective layer during cutting of the semiconductor wafer. After singulation of the semiconductor wafer, the protective layer is removed from the mounting tape.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.