Conductive die attach film for large die semiconductor packages and compositions useful for the preparation thereof
US9449938B2 · kind B2 · utility
0Cited by
12References
45Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 29, 2016 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Jan 29, 2036 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3511
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Provided herein are conductive die attach films having advantageous properties for use in a variety of applications, e.g., for the preparation of large die semiconductor packages. Also provided are formulations useful for the preparation of such films, as well as methods for making such formulations. In additional aspects of the present invention, there are provided conductive networks prepared from compositions according to the present invention. In additional aspects, the invention further relates to articles comprising such conductive die attach films adhered to a suitable substrate therefor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.