Method of making RFID devices on fabrics by stitching metal wires
US9449942B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 20, 2015 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Jul 20, 2035 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/45565
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method for making a Radio Frequency Identification (RFID) device on fabric is described herein. In a first example, an RFID semiconductor chip is attached to a piece of fabric. The RFID semiconductor chip includes two terminals. A solid wire is stitched into the fabric making an RFID antenna. The solid wire is attached to the terminals of the RFID semiconductor chip. In a second example, a metal wire is selected. The metal wire is stitched into fabric making an RFID antenna. The metal wire includes two ends and a conductive adhesive is applied to two ends of the metal wire. An RFID semiconductor chip is attached to the fabric. The RFID semiconductor chip includes two terminals and the RFID semiconductor chip is attached to the fabric at the two terminals. The conductive adhesive is cured. In both examples, the wire and the RFID semiconductor chip are encapsulated in fabric.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.