Cableless connection apparatus and method for communication between chassis
US9450635B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 3, 2014 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Apr 9, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K7/1492
- WIPO fieldDigital communication
- WIPO sectorElectrical engineering
Abstract
Apparatus and methods for cableless connection of components within chassis and between separate chassis. Pairs of Extremely High Frequency (EHF) transceiver chips supporting very short length millimeter-wave wireless communication links are configured to pass radio frequency signals through holes in one or more metal layers in separate chassis and/or frames, enabling components in the separate chassis to communicate without requiring cables between the chassis. Various configurations are disclosed, including multiple configurations for server chassis, storage chassis and arrays, and network/switch chassis. The EHF-based wireless links support link bandwidths of up to 6 gigabits per second, and may be aggregated to facilitate multi-lane links.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.