Embedded architecture using resin coated copper
US9451696B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 29, 2012 |
| Grant date | Sep 20, 2016 |
| Priority date | — |
| Expiry date | Nov 2, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/308
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Electronic assemblies and methods for their manufacture are described, including those related to the formation of an assembly including a carrier and a resin coated copper layer positioned on the carrier. The resin coated copper layer includes a first layer comprising a resin and a second layer comprising copper, with the first layer bonded to the second layer. The first layer of the resin coated copper is positioned between the carrier and the second layer of the resin coated copper. An opening is formed in the second layer of the resin coated copper. A die is positioned in the opening. A plurality of dielectric layers and metal pathways are positioned on the second layer and on the die. Other embodiments are described and claimed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.