Patent · US Active

Method for monitoring cutting processing on a workpiece

US9452544B2 · kind B2 · utility

7Cited by

8References

10Claims

0Family size

Assignee

TRUMPF LASER- UND SYSTEMTECHNIK GMBH · DE

Inventors

Tobias Hagenlocher · Ditzingen, DE
Markus Zimmermann · Riehen, CH

Key dates

Filing date	Aug 14, 2013
Grant date	Sep 27, 2016
Priority date	—
Expiry date	Dec 21, 2034

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T83/865
WIPO fieldMachine tools
WIPO sectorMechanical engineering

Abstract

A method for monitoring cutting processing on a workpiece whereby a part of the workpiece is separated from a remainder of the workpiece along a desired cut contour, wherein, after the cutting processing, the following steps are carried out: irradiating the workpiece with a laser beam at a location within the desired cut contour, detecting radiation generated by an interaction between the laser beam and the workpiece, and evaluating the detected radiation to determine whether, during the cutting processing, the part of the workpiece was completely separated from the remainder of the workpiece. The invention also relates to a laser processing machine for carrying out the method.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.