Molded product manufacturing apparatus, and molded product manufacturing method
US9452554B2 · kind B2 · utility
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Key dates
| Filing date | Oct 4, 2013 |
| Grant date | Sep 27, 2016 |
| Priority date | — |
| Expiry date | Oct 4, 2033 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB29L2011/0016
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
A molded product manufacturing method and a molded product manufacturing apparatus are realized, each of which has improved quality and productivity of a molded product. A pressure to be applied to an upper mold (ML) and a lower mold (ML) is reduced in stages during a process from a start of decrease in internal temperatures of the upper mold (ML) and the lower mold (ML) to a complete mold-release of a resin component (W). This prevents an excessive load from being applied to the resin component (W) which has been molded but has not been mold-released.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.