High impact polystryene having high modulus and resistance to environmental stress cracking
US9453125B2 · kind B2 · utility
1Cited by
7References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 26, 2013 |
| Grant date | Sep 27, 2016 |
| Priority date | — |
| Expiry date | Feb 26, 2033 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L2205/22
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
High impact polystyrenes and related monovinyl aromatic polymers generally have either a high modulus or good resistance to environmental stress cracking. The present invention is directed at polymeric materials having both a high modulus and good resistance to environmental stress cracking thus enabling the down gauging of parts, and or the use of the materials in new applications. The invention is predicated on the use of one or more, or even all of the following features: a high molecular weight matrix polymer, reduced concentration of elastomeric polymer, or methods that result in large rubber particle size.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.