Sensor module and method for producing a sensor module
US9453745B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2012 |
| Grant date | Sep 27, 2016 |
| Priority date | — |
| Expiry date | Mar 21, 2034 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49885
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for producing a sensor module, in which a line part is provided in a first production step, which includes at least one receiving region for the force-fitting and/or form-fitting accommodation of a sensor element, and in a second production step for producing a housing, the line part is extrusion-coated with a plastic material in such a way that the at least one receiving region remains generally free of plastic material, and the sensor element is fixed in place in force-fitting and/or form-fitting manner in the at least one receiving region in a third production step.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.