Molecular glass photoresists containing bisphenol a framework and method for preparing the same and use thereof
US9454076B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 18, 2012 |
| Grant date | Sep 27, 2016 |
| Priority date | — |
| Expiry date | Jun 24, 2032 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC07C2603/92
- WIPO fieldOrganic fine chemistry
- WIPO sectorChemistry
Abstract
The present invention provides a class of molecular glass photoresist (I and II) comprising bisphenol A as a main structure and their preparation. The molecular glass photoresist is formulated with a photoacid generator, a cross-linking agent, a photoresist solvent, and other additives into a positive or negative photoresist. A photoresist with a uniform thickness is formed on a silicon wafer by spin-coating. The photoresist formulation can be used in modern lithography, such as 248 nm photolithography, 193 nm photolithography, extreme-ultraviolet (EUV) lithography, nanoimprint lithography, electron beam lithography, and particularly in the EUV-lithography technique.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.