Laser annealing apparatus and laser annealing method
US9455164B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 19, 2013 |
| Grant date | Sep 27, 2016 |
| Priority date | — |
| Expiry date | Dec 9, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S3/005
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A laser annealing apparatus includes: a laser beam generator for providing a stable single-pulse laser; a cyclic delay unit (300) for splitting the single-pulse laser into several pulsed lasers; an optical module for converging one or more of the pulsed lasers on a substrate (204); and a movable stage (500) for providing the substrate (204) with movement in at least one degree of freedom. A laser annealing method includes: providing a stable single-pulse laser; splitting the single-pulse laser into several pulsed lasers according to a delay requirement and an energy ratio; and irradiating a substrate (204) successively with one or more of the pulsed lasers to keep a surface temperature of the wafer around the melting point or around a needed annealing temperature for a sufficiently long time during the annealing process, thus resulting in an improvement in both the laser energy utilization efficiency and effect of the annealing process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.