Substrate with multiple encapsulated devices
US9455353B2 · kind B2 · utility
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6References
20Claims
0Family size
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Key dates
| Filing date | Jul 31, 2012 |
| Grant date | Sep 27, 2016 |
| Priority date | — |
| Expiry date | Feb 27, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB81C2203/0771
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A device with multiple encapsulated functional layers, includes a substrate, a first functional layer positioned above a top surface of the substrate, the functional layer including a first device portion, a first encapsulating layer encapsulating the first functional layer, a second functional layer positioned above the first encapsulating layer, the second functional layer including a second device portion, and a second encapsulating layer encapsulating the second functional layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.