Molded package for light emitting device and light emitting device using the same
US9455383B2 · kind B2 · utility
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18Claims
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Assignee
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Key dates
| Filing date | Jul 1, 2013 |
| Grant date | Sep 27, 2016 |
| Priority date | — |
| Expiry date | Jul 1, 2033 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8512
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A molded package, comprising: a molded resin having a recess for accommodating a light emitting element; a ceramic substrate disposed in a bottom of the recess, the ceramic substrate having one surface exposed from the bottom of the recess and the other surface exposed from a rear surface of the molded resin; and a lead disposed at a lower part of the molded resin, the light emitting element being mounted on the one surface of the ceramic substrate, the lead being in contact with at least one side surface of the ceramic substrate to hold the ceramic substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.