Signal path in radio-frequency module having laminate substrate
US9456490B2 · kind B2 · utility
Inventors
Key dates
| Filing date | Aug 30, 2014 |
| Grant date | Sep 27, 2016 |
| Priority date | — |
| Expiry date | Dec 12, 2034 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10098
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Improved signal path in radio-frequency (RF) module having laminate substrate. In some embodiments, a laminate substrate for mounting RF components can include N conductor pads positioned at different layers of the laminate substrate. Such conductor pads can include an input pad, an output pad, and at least one intermediate pad between the input and output pads. The laminate substrate can further include a connection feature formed between each neighboring pair among the N conducting pads to provide a signal path between the input pad and the output pad. First and second connection features associated with each of the at least one intermediate pad can be positioned near opposite ends of the intermediate pad to thereby reduce parasitic effects associated with the N conductor pads. Examples of methods and devices related to such laminate substrate are disclosed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.