Method of manufacturing mask
US9457426B2 · kind B2 · utility
2Cited by
1References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 9, 2013 |
| Grant date | Oct 4, 2016 |
| Priority date | — |
| Expiry date | Dec 27, 2034 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K2103/50
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A mask substrate that includes a first area and a second area surrounding the first area is provided. Then, a laser beam is irradiated on the mask substrate to at least partly remove a material of the second area. After that, a physical force is applied to the mask substrate to separate the first area from the mask substrate thereby forming an opening through the mask substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.